Thermal Design and Analysis
Board, component and system thermal evaluation; conduction and convection analysis; cold-plate design; air-to-liquid cooling conversion; packaging and prototyping.
ANSYS / ICEPAK PCB Assembly Thermal Analysis
Thermal-analysis visualization demonstrating temperature distribution and heat-flow behavior within a PCB assembly.
Board & Component Evaluation
Thermal characterization at component, PCB and subsystem levels.
Conduction & Convection
Heat-transfer analysis for electronics enclosures, avionics and packaged systems.
Cold Plate Design
Cold-plate analysis, packaging and prototyping for demanding electronics applications.
Liquid Cooling
Air-cooled to liquid-cooled conversion with integrated fluid components.
Thermal Packaging
Mechanical and RF-control packaging developed with thermal performance in mind.
COTS Conversion
Thermal and packaging adaptation of commercial hardware for rugged and military applications.
Analysis, packaging and prototyping.
